Welsolo VS04 Universal BGA Reballing Stencil

Welsolo VS04 Universal 0.3 / 0.35 / 0.4 / 0.5 BGA Reballing Stencil for Mobile Phone BGA Chip Repair

The Welsolo VS04 Universal BGA Reballing Stencil is a professional-grade reballing template engineered for accurate and efficient BGA chip repair. Designed for modern smartphone and electronic motherboard servicing, this universal stencil supports 0.3mm, 0.35mm, 0.4mm, and 0.5mm solder ball sizes, making it suitable for a wide variety of integrated circuits.

Manufactured from high-quality stainless steel, the VS04 offers excellent heat resistance, durability, and dimensional accuracy. Its precision laser-cut apertures ensure uniform solder ball placement, helping technicians achieve reliable reballing results while reducing alignment errors.

The universal design allows repair professionals to work with multiple BGA ICs without requiring numerous individual stencils, improving workshop efficiency and reducing tool costs. It is ideal for CPU, NAND, eMMC, UFS, PMIC, Wi-Fi ICs, and other BGA package repairs commonly found in smartphones, tablets, and electronic devices.

Compatible with solder paste, solder balls, flux, hot air rework stations, and BGA rework equipment, the Welsolo VS04 provides stable positioning and consistent solder distribution for professional chip-level repairs.

Whether restoring damaged ICs or performing complete BGA reballing, this stencil delivers the precision required for dependable repair results.

Key Features

• Universal BGA reballing stencil
• Supports 0.3mm, 0.35mm, 0.4mm, and 0.5mm solder balls
• Precision laser-cut stainless steel construction
• High heat resistance and long service life
• Accurate solder ball alignment
• Suitable for multiple BGA IC packages
• Reusable professional repair tool
• Compatible with solder paste and solder balls
• Ideal for smartphone motherboard repair
• Designed for professional chip-level technicians

Technical Specifications