Amaoe UAV-1 Stencil For Drone BGA Reballing

Amaoe UAV-1 Stencil For Drone BGA Reballing

The Amaoe UAV-1 Stencil For Drone BGA Reballing is a professional-grade rework tool engineered specifically for precision drone motherboard and PCB chip repairs. Manufactured using high-quality stainless steel with ultra-fine laser-cut apertures, this stencil ensures accurate solder ball placement and consistent alignment during BGA reballing procedures.

Designed for UAV and drone circuit boards, the UAV-1 stencil helps reduce solder bridging, misalignment, and rework errors, ensuring stable electrical connections and long-lasting repair results. Its heat-resistant and corrosion-proof construction allows repeated use in demanding workshop environments, making it an essential tool for drone repair specialists and advanced electronics technicians.

Whether you’re repairing flight controller boards, power management ICs, or communication modules, the Amaoe UAV-1 Stencil delivers precision, durability, and professional-level performance.

Key Features:

• Specifically designed for drone and UAV BGA chip reballing
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball alignment
• Reduces solder bridging and placement errors
• Heat-resistant and corrosion-proof material
• Reusable and easy to clean
• Improves repair accuracy and workflow efficiency
• Ideal for drone motherboard and PCB repairs
• Lightweight and workshop-friendly design
• Suitable for professional repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: UAV-1
• Material: Premium stainless steel
• Application: Drone/UAV BGA reballing & PCB repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Finish: Anti-rust metallic surface
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Drone flight controller & BGA-type IC chips