AMAOE U-IP2 IP6/6P-A8 Stencil for iPhone 6 / 6 Plus

AMAOE U-IP2 IP6/6P-A8 Stencil – Professional A8 CPU Reballing Tool

The AMAOE U-IP2 IP6 6P A8 Stencil is specially developed for professional technicians performing advanced CPU reballing and chip-level repairs on iPhone 6 and iPhone 6 Plus devices. Designed for the A8 processor, this stencil ensures precise solder ball alignment and consistent reballing performance.

Constructed from premium-grade stainless steel, the U-IP2 stencil offers excellent heat resistance and long-lasting durability for repeated use in repair workshops. Its high-precision laser-cut hole pattern guarantees uniform solder ball placement, reducing bridging, short circuits, and repair errors.

Ideal for motherboard rework, CPU IC replacement, and advanced servicing, the AMAOE U-IP2 stencil helps deliver clean, accurate, and professional repair results.

Key Features:

• High-precision laser-cut BGA stencil
• Designed for A8 CPU reballing
• Compatible with iPhone 6 & 6 Plus
• Durable stainless steel construction
• Heat resistant and reusable design
• Accurate solder ball positioning
• Smooth surface for easy cleaning
• Professional-grade chip-level repair tool

Technical Specifications:

• Brand: AMAOE
• Model: U-IP2 (IP6/6P-A8)
• Compatibility: iPhone 6, iPhone 6 Plus
• Chip Support: A8 CPU
• Material: Premium stainless steel
• Type: BGA Reballing Stencil
• Manufacturing Technology: Precision laser cutting
• Usage: Mobile motherboard & CPU repair