Aixun iHeater 3rd Gen Desoldering Station

Aixun iHeater 3rd Gen Intelligent Desoldering Station for Mobile Mainboard Repair

The Aixun iHeater 3rd Gen Intelligent Desoldering Station is a professional motherboard preheating and desoldering platform designed for mobile phone mainboard repair, CPU glue removal, layered board separation, and advanced chip-level maintenance. Built for precision technicians, this intelligent station supports iPhone X–17 series and Android motherboard repair workflows with modular compatibility and highly accurate temperature control.

Powered by advanced PID intelligent temperature algorithm and a high-efficiency MCH ceramic heating plate, the iHeater 3rd Gen delivers rapid, stable, and safe temperature rise for motherboard separation, solder softening, and component disassembly. Its 70°C–260°C adjustable temperature range makes it ideal for CPU adhesive removal, Face ID repair, home button work, dock connector servicing, and Android board preheating.

Designed with a slide buckle lock system, special locating pillars, and a built-in mute cooling fan, this station ensures secure board positioning, faster cooling, and reduced risk of overheating during delicate repair operations. Compact yet powerful, the Aixun iHeater 3rd Gen is an essential solution for technicians who need precise motherboard heating, safe board separation, and efficient repair workflow.

Key Features

• Intelligent PID temperature control system
• High-efficiency MCH ceramic heating plate
• Supports iPhone X–17 series and Android motherboards
• Adjustable temperature range 70°C–260°C
• Slide buckle lock for secure motherboard fixing
• Special locating pillar for accurate board alignment
• Built-in mute cooling fan for rapid cooling
• Ideal for CPU glue removal, Face ID, dock, and board separation
• Compact modular design for professional repair
• Safe and stable motherboard preheating platform

Technical Specifications

• Brand: Aixun
• Model: iHeater 3rd Gen
• Type: Intelligent desoldering / motherboard preheating station
• Rated Power: 110W
• Working Voltage: 110V–220V
• Temperature Range: 70°C–260°C
• Heating Technology: PID + MCH ceramic heating
• Cooling System: Built-in mute cooling fan
• Dimensions: 105 × 105 × 27mm
• Net Weight: Approx. 265g
• Compatibility: iPhone X–17 series / Android motherboards
• Application: CPU glue removal, board separation, motherboard repair