2UUL PadBall Solder Balls for iPhone / Android Solder Pad Rework

2UUL PadBall Solder Balls for iPhone / Android Solder Pad Rework

The 2UUL PadBall Solder Balls for iPhone / Android Solder Pad Rework are engineered for precision micro-soldering and advanced PCB repairs. Designed to restore damaged or worn solder pads, PadBall solder balls provide consistent size, smooth melting, and excellent wetting performance.

Manufactured with high-purity alloy, these solder balls melt evenly and form strong, reliable joints without excessive spreading. They are ideal for BGA pad rebuilding, jumper pad repair, IC pad restoration, and motherboard-level repairs on smartphones and electronic devices.

Whether you’re working on iPhone logic boards or Android PCBs, 2UUL PadBall ensures professional-grade rework results with improved conductivity and durability.

⭐ Key Features

• High-precision solder balls for pad rework
• Uniform size for accurate placement
• Smooth and consistent melting behavior
• Strong bonding and excellent conductivity
• Ideal for iPhone & Android motherboard repair
• Suitable for BGA pad rebuilding
• Minimizes bridging and solder splash
• Easy to use for micro soldering tasks
• Professional repair-grade quality
• Reliable performance for long-term repairs

⚙️ Technical Specifications